AI Technology, Inc.

AI Technology, Inc.

Adhesives; Epoxies; Die Attach Compounds; Under fill Materials; Conductive & Non-Conductive, Bonding; Interconnect Materials - Wire; Ribbon; Tape; Capillaries & Tools, Molding; Encapsulation; Potting; Resin Materials, Package Substrates; Laminate; Film based, Solder; Solder Balls and other Soldering Materials, Tape Automated Bonding (TAB) Accessories, Thermal Interface Materials; Heat Sinks, Thick Film Pastes; Materials, Thin Film; Dielectric Film Materials