Advanced Packaging Interlink Holding Pte Ltd

Advanced Packaging Interlink Holding Pte Ltd

API is a global manufacturer of high-technology equipment, specializing in precision pick-and-place systems and advanced packaging solutions for semiconductor backend processes and micro-component assembly. Our service network spans Singapore, the United States, Japan, China, and other countries, providing comprehensive technical support and consultancy worldwide. At API, our core team consists of top experts from renowned semiconductor giants such as YAMAHA, HITACHI, ASMPT,BESI, K&S, TDK, Goertek, and Keyence. Additionally, we have elite engineers from leading R&D institutions, including the National Energy Laboratory of the United States and the Hong Kong University of Science and Technology Innovation Center. Since our establishment, API has consistently invested in core technologies such as motion control, precision machinery, thermal flow simulation, optical imaging, micro-nano manufacturing, and industrial software. We conduct cutting-edge research and have developed a series of proprietary core technologies, including ultra-thin-die stacking bonders, smart inline solutions for CIS-COB processes, and advanced bonders for multi-chip packaging. This commitment has earned us recognition as a trustworthy and reliable partner for semiconductor OSATs and IDMs. With a mission to drive the upgrade of the global precision intelligent manufacturing industry, API aims to become the global leader in precision pick-and-place technology. We remain customer-focused and strive to deliver innovative micro-nano high-tech equipment for advanced semiconductor packaging.

Die Bonding; Attach Equipment